As AI workloads continue to increase rack densities and power demands, data centre operators are adopting new approaches to cooling, energy efficiency, and infrastructure design.

In this DCN Toronto interview, John C. Campbell, Director of Projects and DX at Telehouse Canada, discusses the key challenges and opportunities associated with supporting AI infrastructure. The conversation covers energy-efficient data centre operations, evolving cooling requirements, and the technologies enabling next-generation AI deployments.

The interview also highlights Telehouse Canada‘s recent Direct Liquid Cooling (DLC) deployment at its downtown Toronto data centre campus. This infrastructure enhancement supports higher-density AI workloads while improving cooling efficiency and operational sustainability through integration with Enwave’s district energy network.

Watch the interview to gain insights into the future of AI-ready data centres and the strategies organizations are using to meet growing power and cooling demands.

Key Topics Covered

  • The infrastructure demands of AI and high-density computing
  • Evolving power and cooling requirements for AI workloads
  • Direct Liquid Cooling (DLC) as an enabler of AI-ready data centres
  • Integrating advanced cooling technologies with district energy systems
  • Energy efficiency and sustainability strategies for modern data centres
  • Retrofitting existing facilities to support AI growth
  • Telehouse Canada’s DLC deployment and operational insights
  • The future of AI infrastructure and data centre innovation

Watch the interview below to learn how leading data centres are preparing for the next generation of AI workloads.